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|
| Position |
Die Attach Engineer |
| Company Info |
An Amercian company in semi conductor industry |
| Responsibilities |
Job description:l Familiar to MOSFET leadframe and Clip design and developmentl Line EQ Automation interface & linkagesl FOL new technologies platform developmentl Partnership with vendor driving Leadframe and Clip tooling design developmentRequirements as below:l |
| Requirements |
Bachelor degree at least, Master is preferred.l Process engineering or
development engineering experience in FOL process, especially on Die
attach or clip attach.l Be familiar with ASM838,ASM 832I, ASM AD-8312 |
| Update |
2023-08-07 |
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