| |
|
| Position |
R&D Manager |
| Company Info |
An American company |
| Responsibilities |
岗位职责：
New Product Development & Prototyping at both inhouse and subcon
Plan and supervise the development projects. Design, plan and select proper
equipment/ materials/tools for the new products. Perform necessary evaluation,
analysis, calculation, simulation, and prototyping.(wire bond)
New Product Release & Transfer
Coordinate with concerned depts on equipment sourcing/layout/buyoff and
support facilities for new product release. Organize and conduct all necessary
activities for Release To Manufacture (RTM) of new packages.
Technical Support
Provide technical & product advice & recommendation on packaging to
product, marketing, and other depts.
New Package Capacity and Cost Estimation
Calculate/estimate the new package capacity and provide their package
assembly cost information.
Quality Improvement
Coordinate with QRA and production on the quality and performance of new
product/process/material/ equipment.
Cost Reduction
Perform new materials/ equipment survey and evaluation. Implement new
material qualification to reduce cost.
Company Intellectual Properties
Conduct activities to protect company intellectual properties
Technology Transfer at both inhouse and subcon
Organize and supervise activities for existing technology transfer to
off-shore facilities and/or designated technology licensee companies
任职要求：
Master’s Degree in Science or engineering
5 years (min) experience in semiconductor back-end packaging
development
Speak, read & write fluent inEnglish & Mandarin.
Knowledge in processes, equipment and material of
semiconductor packaging.
Project management. Problem solving by 8D approach |
| Requirements |
岗位职责：
New Product Development & Prototyping at both inhouse and subcon
Plan and supervise the development projects. Design, plan and select proper
equipment/ materials/tools for the new products. Perform necessary evaluation,
analysis, calculation, simulation, and prototyping.(wire bond)
New Product Release & Transfer
Coordinate with concerned depts on equipment sourcing/layout/buyoff and
support facilities for new product release. Organize and conduct all necessary
activities for Release To Manufacture (RTM) of new packages.
Technical Support
Provide technical & product advice & recommendation on packaging to
product, marketing, and other depts.
New Package Capacity and Cost Estimation
Calculate/estimate the new package capacity and provide their package
assembly cost information.
Quality Improvement
Coordinate with QRA and production on the quality and performance of new
product/process/material/ equipment.
Cost Reduction
Perform new materials/ equipment survey and evaluation. Implement new
material qualification to reduce cost.
Company Intellectual Properties
Conduct activities to protect company intellectual properties
Technology Transfer at both inhouse and subcon
Organize and supervise activities for existing technology transfer to
off-shore facilities and/or designated technology licensee companies
任职要求：
Master’s Degree in Science or engineering
5 years (min) experience in semiconductor back-end packaging
development
Speak, read & write fluent inEnglish & Mandarin.
Knowledge in processes, equipment and material of
semiconductor packaging.
Project management. Problem solving by 8D approach |
| Update |
2017-07-18 |
|
|
